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| Nazwa marki: | rmi |
| Numer modelu: | X-7900 |
| MOQ: | 1 |
| Ceny: | US$ 23000 |
| Szczegóły opakowania: | Drewniane Pudełko |
| Warunki płatności: | T/T |
The Industrial SMT X-Ray Inspection System is a high-precision non-destructive testing (NDT) solution designed for modern electronics manufacturing. Ideal for PCB assembly lines, R&D labs, and small-batch production, this system delivers automated detection of hidden defects such as BGA solder joint cracks, IC welding voids, and head-in-pillow failures. Available with 110kV closed tube or 150kV open tube options, and resolution down to 2µm, it ensures zero-defect quality control for automotive, semiconductor, consumer electronics, and medical devices.
✅ Advanced Imaging Technology
2µm high-resolution microfocus X-ray tube captures fine details of BGA, QFN, and flip-chip solder joints.
Optional 3D CT (computed tomography) inspection provides cross-sectional views for void volume analysis and solder paste quality evaluation.
✅ Flexible Operation Modes
Manual mode for R&D and failure analysis.
Automated (AXI) mode for high-volume PCB production lines, with programmable inspection paths and auto defect recognition (ADR).
✅ Precision Manipulation
5-axis manipulator (X, Y, Z, tilt, rotation) enables inspection of components from any angle, eliminating blind spots under shields, connectors, and heatsinks.
✅ User-Friendly Software
Intuitive interface with BGA void calculation, solder joint measurement, and pass/fail statistics.
Data export for SPC (statistical process control) and traceability.
✅ Compact & Benchtop Options
Space-saving benchtop design available for laboratories and low-volume assembly.
Inline conveyor type for fully automated SMT lines.
| Model | X-7900 |
| Tube Type | Enclosed Type |
| Spatial Resolution | 3 μm |
| Tube Voltage | 130kV |
| Tube Current | 300μA |
| Image Taking Type | Flat-panel Digital |
| Imaging Precision | 85μm |
| A/D Convert Quantified Density Value | 16bit (65536) |
| DPI | 1536*1536px |
| Frame Frequency | 20 FPS |
| Optical Magnification | 450X |
| System Magnification | 2000X |
| Operating System | Windows 11 |
| Power Supply | AC110-220V 50-60HZ |
| Power Consumption | 1200W |
| Radiation Safety Test | <1 μSV/H |
| Detector Rotation Angle | 60° |
| Stage Size | 540*540mm |
| Sensing Range | 510*510mm |
| Load-bearing Capacity | ≤10kg |
| Machine Size | 1098*1389*2157mm (L*W*H) |
| Machine Size (Including Monitor) | 1601*1920*2157mm (L*W*H) |
| Machine Weight | 1050kg |
| Stage Movement | Automatic / Manual |
PCB Assembly: Inspection of BGA, CSP, QFN, LGA, PoP, and through-hole solder joints.
Semiconductor: Die attach, wire bonding, and void detection in power modules.
Automotive Electronics: Solder quality control for ECUs, LiDAR, and battery management systems.
Medical Devices: High-reliability component inspection.
R&D & Failure Analysis: Root cause analysis of soldering defects.
Reduce rework costs by catching hidden defects early.
Increase throughput with automated inspection routines.
Meet industry standards (IPC-A-610, ISO 9001).
Global support with CE, FCC, and ROHS certifications.
Main X-ray inspection unit
Industrial control PC with pre-installed software
Calibration tool kit
Operation manual and safety guide
One-year warranty and remote technical support
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| Nazwa marki: | rmi |
| Numer modelu: | X-7900 |
| MOQ: | 1 |
| Ceny: | US$ 23000 |
| Szczegóły opakowania: | Drewniane Pudełko |
| Warunki płatności: | T/T |
The Industrial SMT X-Ray Inspection System is a high-precision non-destructive testing (NDT) solution designed for modern electronics manufacturing. Ideal for PCB assembly lines, R&D labs, and small-batch production, this system delivers automated detection of hidden defects such as BGA solder joint cracks, IC welding voids, and head-in-pillow failures. Available with 110kV closed tube or 150kV open tube options, and resolution down to 2µm, it ensures zero-defect quality control for automotive, semiconductor, consumer electronics, and medical devices.
✅ Advanced Imaging Technology
2µm high-resolution microfocus X-ray tube captures fine details of BGA, QFN, and flip-chip solder joints.
Optional 3D CT (computed tomography) inspection provides cross-sectional views for void volume analysis and solder paste quality evaluation.
✅ Flexible Operation Modes
Manual mode for R&D and failure analysis.
Automated (AXI) mode for high-volume PCB production lines, with programmable inspection paths and auto defect recognition (ADR).
✅ Precision Manipulation
5-axis manipulator (X, Y, Z, tilt, rotation) enables inspection of components from any angle, eliminating blind spots under shields, connectors, and heatsinks.
✅ User-Friendly Software
Intuitive interface with BGA void calculation, solder joint measurement, and pass/fail statistics.
Data export for SPC (statistical process control) and traceability.
✅ Compact & Benchtop Options
Space-saving benchtop design available for laboratories and low-volume assembly.
Inline conveyor type for fully automated SMT lines.
| Model | X-7900 |
| Tube Type | Enclosed Type |
| Spatial Resolution | 3 μm |
| Tube Voltage | 130kV |
| Tube Current | 300μA |
| Image Taking Type | Flat-panel Digital |
| Imaging Precision | 85μm |
| A/D Convert Quantified Density Value | 16bit (65536) |
| DPI | 1536*1536px |
| Frame Frequency | 20 FPS |
| Optical Magnification | 450X |
| System Magnification | 2000X |
| Operating System | Windows 11 |
| Power Supply | AC110-220V 50-60HZ |
| Power Consumption | 1200W |
| Radiation Safety Test | <1 μSV/H |
| Detector Rotation Angle | 60° |
| Stage Size | 540*540mm |
| Sensing Range | 510*510mm |
| Load-bearing Capacity | ≤10kg |
| Machine Size | 1098*1389*2157mm (L*W*H) |
| Machine Size (Including Monitor) | 1601*1920*2157mm (L*W*H) |
| Machine Weight | 1050kg |
| Stage Movement | Automatic / Manual |
PCB Assembly: Inspection of BGA, CSP, QFN, LGA, PoP, and through-hole solder joints.
Semiconductor: Die attach, wire bonding, and void detection in power modules.
Automotive Electronics: Solder quality control for ECUs, LiDAR, and battery management systems.
Medical Devices: High-reliability component inspection.
R&D & Failure Analysis: Root cause analysis of soldering defects.
Reduce rework costs by catching hidden defects early.
Increase throughput with automated inspection routines.
Meet industry standards (IPC-A-610, ISO 9001).
Global support with CE, FCC, and ROHS certifications.
Main X-ray inspection unit
Industrial control PC with pre-installed software
Calibration tool kit
Operation manual and safety guide
One-year warranty and remote technical support
Adres
Budynek nr 142 / B311, Droga Songyu, społeczność Hongxing, ulica Songgang, dzielnica Baoan, Shenzhen China.
Tel.
+86-16620793861
Wiadomość elektroniczna
alina@hxt-smt.com
